System on a chip
A system on a chip or system-on-chip (SoC /ˌˈɛsoʊsiː/; pl. SoCs /ˌˈɛsoʊsiːz/) is an integrated circuit that integrates most or all components of a computer or other electronic system. These components almost always include on-chip central processing unit (CPU), memory interfaces, input/output devices and interfaces, and secondary storage interfaces, often alongside other components such as radio modems and a graphics processing unit (GPU) – all on a single substrate or microchip.[1] SoCs may contain digital and also analog, mixed-signal and often radio frequency signal processing functions (otherwise it may be considered on a discrete application processor).
Not to be confused with Central processing unit.
Higher-performance SoCs are often paired with dedicated and physically separate memory and secondary storage (such as LPDDR and eUFS or eMMC, respectively) chips, that may be layered on top of the SoC in what is known as a package on package (PoP) configuration, or be placed close to the SoC. Additionally, SoCs may use separate wireless modems.[2]
An SoC integrates a microcontroller, microprocessor or perhaps several processor cores with peripherals like a GPU, Wi-Fi and cellular network radio modems, and/or one or more coprocessors. Similar to how a microcontroller integrates a microprocessor with peripheral circuits and memory, an SoC can be seen as integrating a microcontroller with even more advanced peripherals.
Compared to a multi-chip architecture, an SoC with equivalent functionality will have reduced power consumption as well as a smaller semiconductor die area. This comes at the cost of reduced replaceability of components. By definition, SoC designs are fully or nearly fully integrated across different component modules. For these reasons, there has been a general trend towards tighter integration of components in the computer hardware industry, in part due to the influence of SoCs and lessons learned from the mobile and embedded computing markets.
SoCs are very common in the mobile computing (as in smart devices such as smartphones and tablet computers) and edge computing markets.[3][4]
In general, there are three distinguishable types of SoCs:
SoC chips are typically fabricated using metal–oxide–semiconductor (MOS) technology.[22] The netlists described above are used as the basis for the physical design (place and route) flow to convert the designers' intent into the design of the SoC. Throughout this conversion process, the design is analyzed with static timing modeling, simulation and other tools to ensure that it meets the specified operational parameters such as frequency, power consumption and dissipation, functional integrity (as described in the register transfer level code) and electrical integrity.
When all known bugs have been rectified and these have been re-verified and all physical design checks are done, the physical design files describing each layer of the chip are sent to the foundry's mask shop where a full set of glass lithographic masks will be etched. These are sent to a wafer fabrication plant to create the SoC dice before packaging and testing.
SoCs can be fabricated by several technologies, including:
ASICs consume less power and are faster than FPGAs but cannot be reprogrammed and are expensive to manufacture. FPGA designs are more suitable for lower volume designs, but after enough units of production ASICs reduce the total cost of ownership.[23]
SoC designs consume less power and have a lower cost and higher reliability than the multi-chip systems that they replace. With fewer packages in the system, assembly costs are reduced as well.
However, like most very-large-scale integration (VLSI) designs, the total cost is higher for one large chip than for the same functionality distributed over several smaller chips, because of lower yields and higher non-recurring engineering costs.
When it is not feasible to construct an SoC for a particular application, an alternative is a system in package (SiP) comprising a number of chips in a single package. When produced in large volumes, SoC is more cost-effective than SiP because its packaging is simpler.[24] Another reason SiP may be preferred is waste heat may be too high in a SoC for a given purpose because functional components are too close together, and in an SiP heat will dissipate better from different functional modules since they are physically further apart.
Some examples of systems on a chip are: